SISMA BIG SMARK Diode and Ytterbium fiber marking laser

Versatile
The advanced features of the laser source allow to carry out engraving, marking and cutting operations in line with the highest technical standards. BIG SMARK can be fitted with all SISMA accessories, with the coaxial vision system (CVS) and with the Pattern Matching software.

Practical
The 500 mm x 500 mm working chamber (maximum piece height 530 mm with F100 focal length) is open on three sides to facilitate access.

Digitaly advanced
Entirely developed by SISMA, the integrated software is the ideal solution for file management and parameter definition, even for complex machining.

Modello 200F 200F EP 300F 400F 500F 700F 1000F GREEN UV
Sorgente laser Yb Yb Yb Yb Yb Yb Yb Nd:YV04 Nd:YV04
Lunghezza d'onda 1064 nm 1064 nm 1064 nm 1064 nm 1064 nm 1064 nm 1064 nm 532 nm 355 nm
Potenza media laser 20 W 20 W 30 W 40 W 50 W 70 W 100 W 10 W 3 W
Frequenza impulso 1÷500 kHz 1÷1000 kHz 1÷500 kHz 1÷1000 kHz 1÷500 kHz 1÷500 kHz CW÷1000 kHz 1÷300 kHz 1÷300 kHz
Durata impulso 260/40 ns 3-500 ns 260/40 ns 10-240 ns 250/40 ns 260/40 ns 17/500 ns 30 ns 35 ns
Energia max impulso 1/0,21 mJ 0,03-1 mJ 1/0,21 mJ 0,16 - 1,33 mJ 1/0,21 mJ 1/0,21 mJ 0,1/1 mJ 0,25 mJ 0,075 mJ
Qualità del fascio ≤ 1,6 M2 ≤ 1,6 M2 ≤ 1,6 M2 ≤ 3,5 M2 ≤ 1,6 M2 ≤ 1,6 M2 ≤ 1,6 M2 ≤ 1,2 M2 ≤ 1,3 M
Diametro spot laser 20 μm 20 μm 20 μm 40 μm 20 μm 20 μm 20 μm 12 μm 7 μm
Velocità di marcatura max 2000 mm/s 5000 mm/s 2000 mm/s
Lenti focali F100, F160 (standard), F254, F330 F100, F160 F160
4° asse Optional
Guida laser Class 2M Red Laser Diode; λ=650 nm; 2 mW
Temperatura di lavoro 10°C to 35°C - non condensing
Sistema di raffreddamento Forced-air cooling Water Forced-air cooling
Camera di lavoro 500 x 500 x 380 mm
Alimentazione 230 V ± 15% 50/60 Hz 1ph 0,8 kW
Dimensioni (LxPxA)* 650 x 1040 x 1760 mm
Peso 240 kg

To receive further information on BIG SMARK, please complete the following form. We will reply as soon as possible.