BSS 3D - Diode and Ytterbium fiber marking laser

The Sisma Laser system specific for 2D and 3D deep engraving on molds, matrices, punches, and electrodes through movement of the laser source on a portal with 3 axis with a stroke of 350 mm. The centering is done through a high-resolution ultra-compact camera; working cycles, positioning, and programming are managed by a dedicated software.

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BSS 200F 3D

Wavelength

Nd:YAG - 1064 nm

Average power

20W

Peak power

12 kW

Pulse frequency

1 - 200 kHz

Working area with focal F160

100x100 mm

Laser spot diameter

25 µm

Feeding voltage

230V 50/60Hz monophase

Safety (class)

1

Machine dimensions (LxWxH)

1190x1900x1795 mm

Machine weight

960 Kg

 

BSS 400F 3D

Wavelength

Nd:YAG - 1064 nm

Average power

40W

Peak power

12 kW

Pulse frequency

1 - 200 kHz

Working area with focal F160

100x100 mm

Laser spot diameter

25 µm

Feeding voltage

230V 50/60Hz monophase

Safety (class)

1

Machine dimensions (LxWxH)

1190x1900x1795 mm

Machine weight

960 Kg

Request for Test Marking (Free of Charge*)

* For a limited amount, maximum of 3 pieces

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BSS 3D - Diode and Ytterbium fiber marking laser BSS 3D - Diode and Ytterbium fiber marking laser Product description: The Sisma Laser system specific for 2D and 3D deep engraving on molds, matrices, punches, and electrodes through movement of the laser source on a portal with 3 Sisma Laser Marking engraving marking laser engraver Marking Indonesia logo Sisma Laser Marking New

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